ULTRA WIDEBAND WIRELESS COMMUNICATION AN INTERNATIONAL PANEL OF EXPERTS PROVIDE MAJOR RESEARCH ISSUES AND A SELF-CONTAINED, RAPID INTRODUCTION TO THE THEORY AND APPLICATION OF UWB This book delivers end-to-end coverage of recent advances in both the theory and practical design of ultra wideband (UWB) communication networks. Contributions offer a worldwide perspective on new and emerging applications, including WPAN, sensor and ad hoc networks, wireless telemetry, and telemedicine. The book explores issues related to the physical layer, medium access layer, and networking layer. Following an introductory chapter, the book explores three core areas: Analysis of physical layer and technology issuesSystem design elements, including channel modeling, coexistence, and interference mitigation and controlReview of MAC and network layer issues, up to the application Case studies present examples such as network and transceiver design, assisting the reader in understanding the application of theory to real-world tasks. Ultra Wideband Wireless Communication enables technical professionals, graduate students, engineers, scientists, and academic and professional researchers in mobile and wireless communications to become conversant with the latest theory and applications by offering a survey of all important topics in the field. It also serves as an advanced mathematical treatise; however, the book is organized to allow non-technical readers to bypass the mathematical treatments and still gain an excellent understanding of both theory and practice.
Offers a comprehensive and practical reference guide to antenna design and engineering for portable devices Antennas are often the most bulky components in many portable wireless devices such as mobile phones. Whilst the demand for ever smaller and more powerful wireless devices increases, as does the importance of designing and engineering smaller antennas to fit these devices. Antennas for Portable Devices provides a complete and cutting-edge guide to the design and engineering of small antennas for portable electronic devices such as mobile phone handsets, laptop computers, RFID (radio frequency identification), microwave thermal therapies devices, wearable devices, and UWB (ultra-wideband) based consumer devices. The book addresses practical engineering issues that antenna professionals have to deal with. It explains the immediate demands for existing systems; discusses the antenna technology for the latest and emerging applications, and gives comprehensive coverage of hot topics in the wireless industry. Issues including design considerations, engineering design, measurement setup and methodology, and practical applications are all covered in depth. Antennas for Portable Devices: Covers antennas for all modern portable wireless devices from handsets, RFID tags, laptops, wearable sensors, UWB-based wireless USB dongles and handheld microwave treatment devices Explains how to design and engineer applications for miniaturization of antenna technology, utilising practical case studies to provide the reader with an understanding of systems and design skills Links the basic antenna theory, with design methodology, and engineering design Is amply illustrated with numerous figures and data tables of antenna designs to aid understanding Features contributions from industry and research experts in antenna technology and applications This invaluable resource will provide a comprehensive overview of miniaturizing antenna technology for antenna engineers in industry, and R&D organizations, graduate students, consultants, researchers, RF professionals, technical managers, as well as practitioners working in the area of consumer electronics, RF systems, wireless communications, or bio-medical devices.
Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems The first and only comprehensive text on substrate-integrated mmW antenna technology, state-of-the-art antenna design, and emerging wireless applications Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems elaborates the most important topics related to revolutionary millimeter-wave (mmW) technology. Following a clear description of fundamental concepts including substrate-integrated waveguides and loss analysis, the text treats key design methods, prototyping techniques, and experimental setup and testing. The authors also highlight applications of mmW antennas in 5G wireless communication and next-generation radar systems. Readers are prepared to put techniques into practice through practical discussions of how to set up testing for impedance matching, radiation patterns, gain from 24GHz up to 325 GHz, and more. This book will bring readers state-of-the-art designs and recent progress in substrate-integrated mmW antennas for emerging wireless applications. Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems is the first comprehensive text on the topic, allowing readers to quickly master mmW technology. This book: Introduces basic concepts such as metamaterials Huygens's surface, zero-index structures, and pattern synthesis Describes prototyping in the form of fabrication based on printed-circuit-board, low-temperature-co-fired-ceramic and micromachining Explores applications for next-generation radar and imaging systems such as 24-GHz and 77-GHz vehicular radar systems Elaborates design methods including waveguide-based feeding network, three-dimensional feeding structure, dielectric loaded aperture antenna element, and low-sidelobe synthesis The mmW is one of today's most important emerging technologies. This book provides graduate students, researchers, and engineers with the knowledge they need to deploy mmW systems and develop new antenna designs with low cost, low loss, and low complexity.
Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
